The most flexible atomic force microscope for materials research
Most flexible AFM system for materials research Modular concept to exactly match your needs Suitable for any sample size
For success in materials research studies, scientists depend on professional tools that can readily provide the information needed, regardless of the tasks at hand. By advancing key technologies and designs, Nanosurf has made the Flex-Axiom one of the most versatile and flexible AFMs ever, allowing a large variety of materials research applications to be handled with ease. In combination with the powerful C3000i controller, complex material characterizations are possible.
Used by hundreds of researchers for many applications
The Flex-Axiom is your reliable tool for topographical and metrological imaging of samples in both air and liquid. But the Flex-Axiom goes beyond topography, for example with advanced mechanical, electrical, or magnetic characterization. The system has also been successfully used for local sample manipulation.
The precision and performance you need for your research
The Flex-Axiom uses an extremely linear electromagnetic scanner for XY movement. This scanner delivers an average linearity deviation of less than 0.1% over the full scan range, top-ranking on the AFM market. The Z-axis is piezo-driven, with a position sensor that enables closed-loop operation. A sensitive cantilever detection system can measure well into the MHz frequency range. The scan head is connected to the full-featured, 24-bit C3000i controller with digital feedback and 2 dual-channel lock-in amplifiers.
Harvard's Philip Kim investigates mesoscale transport phenomena of low dimensional nanoscale materials with the Nanosurf Flex-Axiom AFM installed in an MBraun Glovebox MB-200B.
The setup allows sample preparation inside the glovebox
No sample contamination with water or oxygen allows measurement of electrical transport properties
Cable feedthrough done by MBraun; 2 sets of cables included
This overview shows which modes the instrument is capable of. Some modes may require additional components or software options. For details, please view the brochure or contact us.
Standard imaging modes
Static Force Mode
Lateral Force Mode
Dynamic Force Mode (Tapping Mode)
Phase Imaging Mode
Thermal imaging modes
Scanning Thermal Microscopy (SThM)
Magnetic properties
Magnetic Force Microscopy
Electrical properties
Conductive AFM (C-AFM)
Piezoelectric Force Microscopy (PFM)
Electrostatic Force Microscopy (EFM)
Kelvin Probe Force Microscopy (KPFM)
Scanning Spreading Resistance Microscopy (SSRM)
Mechanical properties
Force Spectroscopy
Force Modulation
Stiffness and Modulus
Adhesion
Unfolding and Stretching
Force Mapping
Other measurement modes
Lithography and Nanomanipulation
Electrochemical AFM (EC-AFM)
Applications
Flex-Axiom application examples
Topography of SrTiO3 in dynamic mode
Strontium titanate (SrTiO3, STO) is an oxide of titanium and strontium exhibiting a perovskite structure. It has interesting and partly unique material properties. It is used as substrate for growth of oxide-based thin films and high-temperature superconductors.
STO forms surfaces that show a layered structure. The thickness of individual layers is in the range of a few Angstrom. Atomic force microscopy is an ideal tool to image and measure these structures.
Topography showing steps of strontium titanate; image size 1.1µm
Section profile and height distribution
The sample clearly shows the typical layer structure STO. Here, the layers are not perfectly smooth, but exhibit residual roughness of approx. 125 pm (RMS). This is caused by a non-ideal termination process during the preparation of this STO sample.
The graph shows the profile of the image shown above along a line extending from the top left to the bottom right corner of the imaged area. The profile also clearly shows the layered structure of the sample and reveals step heights of approx. 4 Å. Similarly in the right panel, the height distribution histogram of the image above clearly shows approx. 4 Å-spaced peaks for the different layers of the sample.
Topography and KPFM of CVD grown molybdenum disulfide monolayers
In this application note, monolayer MoS2 grown by chemical vapor deposition (CVD) was imaged with Kelvin probe force microscopy (KPFM) using a Flex-Axiom to study the contact potential difference variation on a single crystal.
Monolayers of MoS2 were grown on a silicon substrate by chemical vapor deposition (Sample courtesy: University of Illinois – Urbana-Champlain).
Non-uniformity of the contact potential signal across the monolayer can inform about doping profiles and other surface defects.
MoS2 monolayers optical micrograph
a) AFM topography image of single MoS2 monolayer. Location where profile is taken indicted by red line. b) Height (top) and KPFM voltage (bottom) profile across monolayer
Measurements using the Flex-Axiom show a step height of 0.6 nm for the MoS2 monolayer. Concurrent KPFM measurements show a 650 mV contact potential difference between the monolayer and the SiO2 substrate.
3D AFM topography overlay MoS2
All measurements were performed using a Flex-Axiom system equipped with a ANSCM-PA cantilever from AppNano. Images were processed using MountainsMap SPM.
An enabling technology for micro-manipulation of single cells and other small objects, surfaces and tissues
Nanofluidics through a hollow cantilever combined with the positional accuracy and force control of the Nanosurf FlexAFM
Specialized application modules for different applications as injection, pick-and-place, adhesion force spectroscopy, elasticity measurements, and spotting
Suitable for stand-alone setup and on the inverted microscope
Flex-ANA upgrade
Nanomechanical tissue diagnostics and soft material analysis
Fully automated measurements on rough and non-even surfaces
Quantitative analysis of tissues and soft materials alike
Fast, objective, and routine sample categorization
Specifications
Flex-Axiom specifications and dimensions
System specifications
FlexAFM 5 scan head specifications with C3000i controller
100-µm scan head
10-µm scan head
Sample size
Unlimited without sample stage
100 mm on sample stage
Maximum Petri dish height (fluid level)
9 mm (6 mm)
Manual height adjustment range
6 mm
Motorized approach range (at tip position)
2 mm
Max. scan range (XY)
100 µm1
10 µm1
Max. height range (Z)
10 µm2
3 µm1
XY-linearity mean error
< 0.1%
XY-flatness at maximum scan range
typ. 5 nm
typ. 1 nm
Detector bandwidth
DC - 4 MHz
Detector noise level (RMS)
typ. 60 pm / max. 100 pm (3, 4)
Z-sensor noise level (RMS)
typ. 180 pm / max. 200 pm (3)
Z-measurement noise level (RMS, static mode in air)
typ. 100 pm / max. 200 pm
Z-measurement noise level (RMS, dynamic mode in air)
typ. 35 pm / max. 50 pm
Scan head dimensions
413 x 158 x 53 mm
Scan head weight
1.25 kg
(1) Manufacturing tolerances ± 5%
(2) Manufacturing tolerances ± 10%
(3) Measured at 2 kHz
(4) Measured with XYContr cantilever
C3000i controller — Core hardware specifications
X/Y/Z-axis scan and position controller
3× 24-bit DAC (200 kHz)
X/Y/Z-axis position measurement
1× 24-bit ADC (200 kHz)
Excitation & modulation outputs
2× 16-bit DAC (20 MHz)
Analog signal input bandwidth
0–5 MHz
Main input signal capturing
2× 16-bit ADC (20 MHz)
2× 24-bit ADC (200 kHz)
Additional user signal outputs
1× 24-bit ADC (200 kHz)
Digital synchronization
Sync Out 1/2: digital outputs, signal range 0/5V TTL pulses
FPGA module and embedded processor
ALTERA FPGA,
32-bit NIOS-CPU,
80 MHz, 256 MB RAM,
multitasking OS
Communication
USB 2.0 Hi-Speed to PC and scan head interface
System clock
Internal quarts (10 MHz) or external clock
Power
90–240 V AC, 70 W, 50/60Hz
Cantilever
Width
min. 20 μm
Length
min. 40 μm
Reflective coating
Reflective coating recommended
Liquid measurements
Yes, with gold coating
Alignment grooves
Required by default
Special cantilever holders without alignment grooves are available
Resonance frequency dynamic mode Easyscan 2 Controller
15 kHz to 350 kHz
Resonance frequency dynamic mode C3000 Controller
< 4 MHz
Cantilever shape
Single rectangular cantilevers and multilever cantilevers (depending on scan head version and cantilever holder)
Chip thickness
300 μm, 500 μm or 600 μm depending on cantilever holder